The wait is no more. AMD lifted the curtains off of its Ryzen 5000 series processors and its Zen 3 core architecture at its “Where Gaming Begins” conference yesterday.
Zen 3, like Zen 2, uses a separate CPU die and I/O die on the same package. The CPU die is manufactured using TSMC’s 7nm node, while the I/O die is made on the 12nm node. Separating the I/O die and CPU dies help with yields as smaller chips are easier to manufacture.
tap here to see other videos from our team.
AMD’s Zen 3 architecture continues to improve on Zen 2’s modular design. In the previous generation, AMD’s Ryzen 3000 series desktop processors used multiple core chiplet dies (CCD) consisting of two 4-core compute core complexes (CCX) connected over the Infinity Fabric Interconnect. Each CCX had its own, separate 16MB cache. With Zen 3, AMD has unified the pools of cache into a single 32MB pool, thus decreasing latency and increasing resource sharing across the cores.